LED整板3D胶高测量机是用到测量LED金属托架涂胶后的氢氧化铁宽度,经由激光束检侧枝术,就能很快、正确地测量出LED胶面宽度地域差异的全智能的设备。该设备利用PLC+PC软件,将置于好的料匣经由导入带和模组构造,的一半层的将原料推入3D摄影机测量职位,将采样到的统计资料引入给镭射软件,标示出缺陷报告职位,并经由摄影机拍摄照片测量镭射的明确性,测量软件就能全智能类别缺陷报告品类及数量统计,空机产值。 镭射完成后的整板金属托架将由模组模块的一半层的收集整理到料匣后面,高低料就能缓存文件最少6个料匣(72金属托架),每个料匣就能孤立线上识别产值规格。 The machine is used to detect the colloid height of the LED stand after dispensing. Through laser scanning technology, the machine adopts PLC+PC system, which can quickly and accurately detect the difference in the height of the LED glue surface.
